SCT EVG and Teramount collaborate on packaging technologies for PICs

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EV Group of St Florian, Austria – a supplier of wafer bonding and lithography equipment for semiconductor, micro-electro-mechanical systems (MEMS) and nanotechnology applications – and Teramount of Jerusalem, Israel (which provides scalable solutions for connecting optical fibers to silicon chips for data center, advanced computing, sensors and other datacom and telecom applications) are collaborating on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber chip packaging. The collaboration will leverage EVG’s nanoimprint lithography (NIL) technology, expertise and services with Teramount’s PhotonicPlug technology...

Source: http://www.semiconductor-today.com/news ... 0322.shtml